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dt-bindings: arm: ti: Add binding for AM625 SiP

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The AM6254atl SiP belongs to the K3 Multicore SoC architecture platform,
providing AM625 SoC with 512MiB of integrated DDR in the package.

For further information about the package check:
https://www.ti.com/lit/ds/symlink/am625sip.pdf

Signed-off-by: Anshul Dalal <anshuld@ti.com>
Reviewed-by: Bryan Brattlof <bb@ti.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20250814134531.2743874-3-anshuld@ti.com
Signed-off-by: Nishanth Menon <nm@ti.com>
This commit is contained in:
Anshul Dalal
2025-09-12 11:41:48 +05:30
committed by Nishanth Menon
parent e0b9feca73
commit 3e915577cf
1 changed files with 7 additions and 0 deletions
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Documentation/devicetree/bindings/arm/ti/k3.yaml
+7
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@@ -58,6 +58,13 @@ properties:
- ti,am62-lp-sk
- const: ti,am625
- description: K3 AM6254atl SiP
items:
- enum:
- ti,am6254atl-sk
- const: ti,am6254atl
- const: ti,am625
- description: K3 AM62x SoC Toradex Verdin Modules and Carrier Boards
items:
- enum: